data sheet semiconductor http://www.yeashin.com 1 rev.02 20120705 h YSPLCXXC applications high-speed data lines microprocessor based equipment lan/wan equipment notebooks, desktops, and servers instrumentation 10/100 ethernet iec compatibility iec61000-4-2 (esd) 15kv (air), 8kv (contact) iec61000-4-4 (eft) 40a (5/50 s) features 350 watts peak pulse power per line (tp=8/20 s) protects one high-speed i/o line (bidirection) low capacitance for high-speed interfaces low clamping and operating voltage rohs compliant mechanical characteristics sot-143 package molding compound flammability rating : ul 94v-o weight 9.0 millgrams (approximate) quantity per reel : 3,000pcs reel size : 7 inch lead finish : lead free sot-143 pin configuration low capacitance tvs diode array
http://www.yeashin.com 2 rev.02 20120705 YSPLCXXC device characteristics (v) (v) @1a ( a) (pf) (max.) (min.) (ma) (max.) (max.) (@a) (max.) (typ.) 4 1 3 6 1 3 ysplc36c dte 36 40 1 53 75 260 (10 sec.) part number device marking v rwm electrical characteristics per line (@ 25 unless otherwise specified) v c i t t l v c i r storage temperature range t stg -55 ~ 150 units peak pulse power (tp=8/20s waveform) t j symbol v b c t ysplc33c dt3 3.3 4 1 3 40 23 maximum ratings (@ 25 unless otherwise specified) lead soldering temperature operating temperature range value parameter 350 watts -55 ~ 150 p pp 7 20 ysplc05c dt5 5 6 1 9.8 24 22 5 3 ysplc08c dt8 8 8.5 1 13.4 26 20 1 3 ysplc12c dta 12 13.3 1 19 34 12 1 3 ysplc15c dtb 15 16.7 1 25 40 10 1 3 ysplc24c dtd 24 26.7 1 40 60
http://www.yeashin.com 3 rev.02 20120705 YSPLCXXC package outline & dimensions * soldering footprint
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